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    "name": "WSBB PCB panel designs post-run1",
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      "content": "Thought I'd start a thread here - not a fire but we are expecting to want to update the breakout PCB panels for run 2 onwards, based on feedback from the COB supplier(s)\n\nExamples of current suggestions have been for slighlty different rails between panels and different qty of rows and columns. I expect that we can confirm any changes by the end of this month or early October, then be ready to order boards mid October. CC @Andrew Wingate and @RebelMike and @Tim 'mithro' Ansell",
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      "content": "so TLDR: no action for now, but expect a request for some board/panel revs early Oct and hopefully some time for doing the updates in first couple of weeks of Oct",
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      "content": "I'll share further updates here as and when makes sense",
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      "content": "Note there's this issue on the CoB repo with some potential changes for discussion: https://github.com/wafer-space/chip-on-board-wire-bonded-pcbs/issues/11",
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      "content": "I think this is less about the layout of the CoB board themselves and more about how they are panalized? @stuart - Is that correct?",
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      "content": "Yes that's correct, although I wouldn't rule out small tweaks like soldermask between the die and bond pads, area for serial number and similar",
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      "content": "Afair one of the die boards still has soldermask between the die and pads for example. I'll ensure we get feedback from the new bonding places so we have a spec to work from",
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